Research Scientist - Flex Electronics Materials

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Research Scientist - Flex Electronics Materials
Meta black iconMeta Quest
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Redmond, WA
At Reality Labs Research (RL-R), our goal is to explore, innovate and design novel interfaces and hardware subsystems for the next generation of virtual, augmented, and mixed reality experiences. We are looking for a skilled and motivated Materials for Advanced Electronics Research Scientist to join our team, whose mission is to create flexible and reliable electronic devices with uncompromised performance. We are specifically looking for a candidate with experience in researching and developing new materials and interfacial bonding strategies through directing internal efforts or through guidance of materials vendors for advanced electronics packaging applications and for someone who can work with a team of researchers who are solving the materials, manufacturing and performance needs for a new paradigm of worn devices. More broadly, the chosen candidate will work with a diverse and highly interdisciplinary team of researchers and engineers and will have access to cutting edge technology, resources, and testing facilities.
Research Scientist - Flex Electronics Materials Responsibilities
  • Research and develop new materials, interfacial bonding strategies and novel materials processing techniques for creating high performance and highly integrated electronic devices, focused on improving flexibility and reliability while balancing other factors like electrical performance, thermal performance and manufacturability
  • Direct technical efforts of an internal team (technicians, operators, researchers) and external partner efforts (including with materials suppliers) efficiently and effectively towards program/project goals
  • Advise on and implement new materials and chemistries based upon external academic and industrial progressions
  • Collaborate with research scientists and engineers from broad disciplines to translate complex technology needs into appropriate experimental efforts and research directions
Minimum Qualifications
  • Currently has a PhD degree in chemistry, polymer science, materials science, chemical engineering, a relevant technical field, or equivalent practical experience
  • 3+ years experience tuning the underlying chemistry and resultant physics of materials for electronic packaging applications (i.e. substrate, trace, thermal, interconnect or encapsulant materials) towards specific desired properties (i.e. improved flexibility or reliability)
  • 3+ years experience working with materials vendors or application partners to tune material chemistry for optimization of specific material property vectors
  • 1+ years experience optimizing bonding at materials interfaces within advanced electronics, especially while leveraging common electronics manufacturing techniques such as semiconductor fabrication techniques (i.e. wafer or panel processing), molding or printing
  • 1+ years experience with low-modulus flexible or elastomeric materials as applied towards advanced electronics
  • Bachelor's degree in Computer Science, Computer Engineering, relevant technical field, or equivalent practical experience.
Preferred Qualifications
  • Experience with interlayer dielectrics (i.e. polyimide), photopatternable resins, silicones, elastomers, polymeric electrolyte materials, nanomaterials, dispersions, or composites and with their fabrication processes when used within semiconductor manufacturing processes, 2D/3D printing methods or micro-molding processes
  • Knowledge in adhesion science, electronics material properties, dispersion science, analytical chemistry, surface science, mechanical/electrical property characterization techniques, or electrode/electrolyte interactions
  • Experience with advanced electronic device materials including: underfills, thermal materials, encapsulation/ingress protection materials, interconnects, high speed substrates, shielding materials
  • Track record of working with and growing partnerships with materials vendors to develop materials pushing performance or reliability vectors within consumer electronic devices while balanced with internal R&D efforts through supervision of operators and technicians
  • Experience with materials FEA modeling, including mechanics, reliability, moisture ingress, metamaterials, and/or electromechanical simulations
About Meta
Meta builds technologies that help people connect, find communities, and grow businesses. When Facebook launched in 2004, it changed the way people connect. Apps like Messenger, Instagram and WhatsApp further empowered billions around the world. Now, Meta is moving beyond 2D screens toward immersive experiences like augmented and virtual reality to help build the next evolution in social technology. People who choose to build their careers by building with us at Meta help shape a future that will take us beyond what digital connection makes possible today—beyond the constraints of screens, the limits of distance, and even the rules of physics.
Meta is committed to providing reasonable support (called accommodations) in our recruiting processes for candidates with disabilities, long term conditions, mental health conditions or sincerely held religious beliefs, or who are neurodivergent or require pregnancy-related support. If you need support, please reach out to
$143,000/year to $204,000/year + bonus + equity + benefits

Individual pay is determined by skills, qualifications, experience, and location. Compensation details listed in this posting reflect the base salary only, and do not include bonus, equity or sales incentives, if applicable. In addition to base salary, Meta offers benefits. Learn more about benefits at Meta.
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