Meta is seeking a Thermal Engineer to join our Hardware Design Team. Our systems and data-centers are the foundation upon which our rapidly scaling infrastructure operates and upon which our innovative services are delivered. Our team is responsible for the Thermal hardware design across network, compute and storage devices, evaluating and advancing current and emerging thermal technologies, from liquid cooling to thermal packaging, and optimizing our hardware for high performing, efficient data center operation. A candidate selected for this role will be an integral member of the Thermal Hardware Team, responsible for owning thermal design and optimization for new hardware and evaluating thermal packaging technology. The engineer will be responsible for solving heat transfer problems occurring in silicon packaging, complex subcomponents or full hardware systems, using comprehensive thermal design fundamentals and analytical tools. The ideal candidate would have a solid grasp of thermal fundamentals, and ability to work with our team, partners and vendors to deepen their knowledge base. The candidate will adapt/learn quickly, and is willing and able to work collaboratively across fast-paced, multi-disciplinary teams. This role is a great opportunity for candidates to learn end-to-end thermal aspects of hardware: from thermal design for systems, to DC environments. This includes getting involved in Thermal packaging technology advancement, hands-on platform design, and lab test development and execution. Doing so with a scalable and reliable methodology in mind.